Qee cov laj thawj tshwj xeeb thiab cov kev daws teeb meem ntsig txog qhov tsis txaus ntawm substrates hauv solventless lamination
1. Cov laj thawj cuam tshuam nrog kua nplaum
1.1. Tsis tsim nyog xaiv cov kua nplaum
Yog vim li cas: hom nplaum tsis phim rau substrate (xws li incompatibility ntawm polar thiab tsis-polar nplaum).
Kev daws: -Select tshwj xeeb cov nplaum (xws li polyurethane, epoxy, epoxy, xws li tus yam ntxwv ntawm substrate (xws li PE, Tsiaj, txhuas ntawv nyiaj).
-Cov nrog cov nplaum nplaum nplaum nplaum thiab muab cov qauv rau cov qauv rau kev ntsuas kev sib raug zoo.
1.2. Nplaum sib piv lossis sib xyaw teeb meem
Vim li cas: tsis raug cai lossis tsis sib xws ntawm cov neeg sawv cev tseem ceeb thiab tus neeg kho tus sawv cev.
Kev daws: -calibrate cov twj tso kua mis sib xyaw thiab cov metering system kom ntseeg tau tias muaj feem sib npaug.
-Cov yog cov khoom siv hluav taws xob zoo li qub yog txhaws thiab hloov cov khoom sib tov tsis tu ncua.
1.3. Tsis txaus ntseeg cov nyiaj
Vim li cas: tus nplaum nplaum yog tsawg dhau (xws li<1.2g/m ²) to form an effective bonding layer.
Kev daws: -Ard kom sib txawv ntawm txheej rollers thiab nce ntxiv txheej txheej (feem ntau 1. {2}}. 5g \/ m ²).
-Cov lub viscosity ntawm cov nplaum thiab preheat cov substrate (xws li PE zaj duab xis rau 40-50 degree) yog tias tsim nyog los txhim kho qib.
2. Substrate Ua Cov Teeb Meem
2.1. Kev kho mob tsis txaus
Vim li cas: Corona qis tus nqi ntawm lub substrate (xws li<38 dynes/cm ²) prevents the adhesive from wetting the surface.
Solut: -re Corona kho cov txheej txheem (lub hom phiaj) 40-44 dynes \/ cm ²nes).
3. Txheej Txheem Ntsuas Teeb Meem
3.1. Cov Lamination tsis txaus siab lossis kub
Vim li cas: kev sib cuag tsis txaus ntawm cov txheej txheej nplaum thiab cov txheej txheem vim yog qhov siab qis (xws li<0.3MPa) or low temperature (such as<35 ℃).
Kev daws: -Txoj lub siab ({{0. {{}. 8Mpa} ({}} degree) ntawm cov menyuam sib xyaw.
4. Kev Kho Mob Qhov Teeb Meem
4.1.inslus Thawm lossis Kub
Vim li cas: lub sijhawm kho tau luv heev (xws li<24 hours) or the ambient temperature is low (such as<25 ℃), resulting in incomplete cross-linking of the adhesive.
Kev daws: Ntev kho lub sijhawm
4.2.Qhov cov av noo hiav txwv yog qhov siab heev
Vim li cas: Thaum cov av noo siab tshaj 70% RH, cov kua nplaum yuav nqus noo noo thiab ua rau caping.
Kev daws: Kev tswj cov av noo hauv lub rhiav ntawm 40-60% rh.
Siv lub dehumidifier lossis muab chav tsev ua tiav.
Qee cov laj thawj tshwj xeeb thiab cov kev daws teeb meem ntsig txog qhov tsis txaus ntawm substrates hauv solventless lamination
Mar 31, 2025
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